BUSINESS: ERS Electronic Appoints Mark Wachter Chief Financial Officer

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Daniel Webster, dWeb.News Editor

January 13, 2022 05: 00 AM Eastern Standard Time

MUNICH–(BUSINESS WIRE)–ERS electronic, the world leader in the market of thermal management solutions for semiconductor manufacturing, announces the appointment of Mark Wachter as Chief Financial Officer of the company.

Following its strong financial performance and all-time high revenue in 2021, ERS is expanding its C-level executive team with a new member. Wachter will take over all financial operations at ERS worldwide.

Wachter was previously Head of Controlling and Finance at Beissbarth GmbH (a major provider of innovative workshop equipment to vehicle mobility). He brings more than 21 years of experience from various financial positions and executive roles in automotive and electronic manufacturing companies like Bosch and Porsche.

Laurent Giaiminiet, CEO, ERS electronic, said that Mark has a track record of financial leadership and delivering outstanding results. Mark’s financial expertise and operational discipline make him the ideal candidate to drive our growth strategy as we scale ERS.

“Since its foundation in 1970, ERS has built an outstanding reputation in the semiconductor manufacturing industry. Wachter stated that the company is constantly innovating and growing at an even faster pace than ever before. It is an exciting time to join this ambitious team.” “I look forward to taking on the role of CFO, helping ERS achieve its strategic priorities and strengthening its financial performance.”

About ERS:

ERS electronic GmbH, based around Munich, has been providing innovative thermal management solutions to the semiconductor industry for more than 50 years. The company has gained an outstanding reputation, notably with its fast and accurate air cooling-based thermal chuck systems for test temperatures ranging from -65degC to +550degC for analytical, parameter-related and manufacturing probing. ERS also supplies the Advanced Packaging market with its fully automatic and manual debonding and warpage adjust tools used in the production of 200 and 300 mm eWLB device packages. On a broader scale, ERS supports not only eWLB but many other Fan-Out Wafer-Level-Packaging (FOWLP) and Panel-Level-Packaging (FOPLP) technologies up to 650 x 650 mm format.

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